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MC6501 Nickel-Gold Plated Alumina Ceramic Substrate

  • Catalog No. MC6501
  • Material Nickel, Gold, Alumina
  • Appearance Golden Yellow Plate
  • Thickness 1.0 mm

MC6501 Nickel-Gold Plated Alumina Ceramic Substrate

Nickel-Gold Plated Alumina Ceramic Substrate
Nickel-Gold Plated Alumina Ceramic Substrate

Overview

The Nickel-Gold Plated Alumina Ceramic Substrate is a high-performance material engineered for advanced electronic applications. Combining the superior thermal conductivity and electrical insulation of alumina (Al₂O₃) with nickel-gold plating, this substrate offers enhanced conductivity, excellent solderability, and robust corrosion resistance. Its gold layer provides outstanding oxidation resistance and wire bonding capabilities, making it ideal for high-frequency and high-reliability electronic systems. With exceptional thermal stability and durability, it is a preferred choice in power electronics, semiconductor packaging, RF and microwave devices, and aerospace applications.

Specifications

Parameter Details
Materials Nickel, Gold, Alumina
Color/Appearance Golden Yellow Plate
Thickness 1.0 mm
Layers Double-sided
Copper Thickness 200 µm
Solder Mask None
Finish Immersion Nickel Gold
Exterior Machining Waterjet Cutting

Key Features

  • High Thermal Conductivity: Efficient heat dissipation for high-power applications.
  • Electrical Insulation: Prevents short circuits, ensuring stable device performance.
  • Corrosion & Oxidation Resistance: Enhanced durability and longevity through gold plating.
  • Mechanical Strength: Robust structural integrity for demanding environments.
  • Excellent Solderability: Reliable and secure connections with superior wire bonding capabilities.

Applications

  1. Power Electronics

    • Uses: High-power circuits, power modules, IGBT modules
    • Benefits: Superior thermal management and electrical insulation ensure efficient and stable operation.
  2. Semiconductor Packaging

    • Uses: Chip carriers, LED modules, MEMS devices
    • Benefits: Provides a reliable, corrosion-resistant platform for delicate semiconductor components.
  3. RF & Microwave Devices

    • Uses: High-frequency circuits, antennas, communication modules
    • Benefits: Low dielectric loss and high thermal stability enhance performance in high-frequency applications.
  4. Aerospace & Military

    • Uses: Radar systems, satellite communications, defense electronics
    • Benefits: High reliability and resistance to harsh environments ensure performance in critical applications.
  5. Medical Devices

    • Uses: Implantable electronics, diagnostic equipment
    • Benefits: Biocompatibility, precision, and durability support the stringent requirements of medical technologies.
  6. Automotive Electronics

    • Uses: Electric vehicles (EVs), hybrid systems, advanced driver-assistance systems (ADAS)
    • Benefits: High temperature resistance and long-term reliability are essential for automotive applications.

Packaging Information

Our Nickel-Gold Plated Alumina Ceramic Substrates are meticulously handled during storage and transportation to maintain their pristine quality. Each substrate is packaged with care to prevent damage and ensure it arrives in optimal condition.

Frequently Asked Questions (FAQ)

Q1: What is a Nickel-Gold Plated Alumina Ceramic Substrate?

A1: It is a high-performance ceramic substrate made from alumina (Al₂O₃) with a nickel-gold plating layer. This combination offers high thermal conductivity, excellent electrical insulation, strong corrosion resistance, and reliable solderability, making it ideal for applications in power electronics, semiconductor packaging, RF & microwave devices, and aerospace.

Q2: What are the advantages of using a Nickel-Gold Plated Alumina Ceramic Substrate?

A2:

  • Excellent Thermal Conductivity: Efficiently dissipates heat in high-power applications.
  • Superior Electrical Insulation: Prevents short circuits and ensures stable device performance.
  • Corrosion and Oxidation Resistance: Gold plating enhances durability and reliability.
  • High Mechanical Strength: Provides robust structural integrity.
  • Good Solderability and Wire Bonding Capability: Ensures secure and efficient electrical connections.

Q3: What applications are these substrates commonly used for?

A3:

  • Power Electronics: IGBT modules, power circuits, energy-efficient systems.
  • Semiconductor Packaging: LED modules, MEMS, chip carriers.
  • RF & Microwave Devices: High-frequency circuits, antennas, radar systems.
  • Aerospace and Defense: Satellite communication, military electronics, avionics.
  • Medical Electronics: Implantable medical devices, diagnostic equipment.
  • Automotive Electronics: Electric vehicle power systems, ADAS components.
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