Description

The Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate harnesses the high thermal conductivity and excellent electrical insulation properties of aluminum nitride (AlN). The double-sided nickel-palladium-gold plating not only improves solderability but also provides outstanding protection against corrosion and oxidation, ensuring reliable connections and prolonged durability. With a 0.070mm copper layer incorporated into its structure, this substrate significantly enhances electrical conductivity, making it well-suited for high-power and high-frequency applications.

Key Features:

• High Thermal Conductivity: Efficiently dissipates heat, maintaining optimal operating temperatures in high-power scenarios.
• Exceptional Electrical Insulation: Ensures reliable electrical isolation, crucial for stable and efficient operation of electronic components.
• Superior Mechanical Strength: Offers robust structural integrity, guaranteeing long-term reliability in challenging environments.
• Enhanced Solderability and Corrosion Resistance: Nickel-palladium-gold plating facilitates secure solder connections and protects against environmental degradation.
• Low Dielectric Loss: Maintains signal integrity in high-frequency applications, ensuring minimal energy loss.
• High-Temperature Stability: Operates consistently under extreme temperature conditions, ideal for advanced electronic packaging and RF devices.

Whether integrated into power modules, RF devices, or automotive electronics, this substrate ensures consistent and dependable performance, making it a preferred choice for advanced electronic systems.

Specifications

Applications

The Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate is indispensable in a wide range of high-performance applications, including:

1. High-Power Electronics

   • Uses: Power modules, LED drivers
   • Benefits: Ensures efficient thermal management and superior electrical conductivity for reliable power distribution.

2. RF and Microwave Devices

   • Uses: RF modules, microwave circuits
   • Benefits: Maintains signal integrity and minimizes thermal interference in high-frequency environments.

3. Advanced Electronic Packaging

   • Uses: Electronic assemblies, multi-layer circuit boards
   • Benefits: Provides excellent solderability and corrosion resistance for durable and reliable connections.

4. LED Packaging and Laser Modules

   • Uses: High-brightness LEDs, laser diodes
   • Benefits: Facilitates efficient heat dissipation and ensures long-term performance of optoelectronic components.

5. Automotive Electronics

   • Uses: Electric vehicle components, advanced driver assistance systems (ADAS)
   • Benefits: Robust thermal and electrical properties suitable for the demanding automotive environment.

6. Aerospace and Defense Electronics

   • Uses: Avionics, satellite systems, defense electronics
   • Benefits: Reliable performance and durability under extreme conditions, ensuring mission-critical operations.

7. High-Frequency Circuits

   • Uses: Communication devices, high-speed data transmission
   • Benefits: Low dielectric loss and high-temperature stability support efficient and reliable high-frequency performance.

Packaging

Our Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate is meticulously packaged to preserve its quality and integrity during storage and transportation. Each substrate is individually secured to prevent any physical damage, ensuring it arrives at your facility in pristine condition. This careful handling guarantees that the substrate is ready for immediate integration into your high-performance electronic systems without any compromise in functionality or reliability.

Frequently Asked Questions (FAQ)

Q1: What are the main characteristics of this substrate?
A1: The Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate boasts high thermal conductivity, excellent electrical insulation, outstanding mechanical strength, and a robust nickel-palladium-gold plating. These features ensure superior solderability, corrosion resistance, and reliability, making it ideal for demanding electronic applications.

Q2: What applications is this product suitable for?
A2: This substrate is primarily used in high-power electronic devices, RF and microwave equipment, LED packaging, laser modules, power electronics modules, as well as automotive and aerospace electronic systems. Its efficient thermal management and reliable electrical performance make it suitable for a wide range of advanced applications.

Q3: What is the thermal conductivity of this substrate?
A3: Aluminum nitride (AlN) substrates typically exhibit a thermal conductivity of 170-200 W/m·K, which is significantly higher than conventional ceramic materials like alumina (Al₂O₃). This high thermal conductivity ensures efficient heat dissipation, essential for applications requiring optimal thermal management.