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MC6502 Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip

  • Catalog No. MC6502
  • Material Nickel, Gold, Palladium, Alumina
  • Synonyms Semiconductor Thermoelectric Cooler
  • Thickness 0.25 mm

MC6502 Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip

Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip
Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip

Description

The Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip is crafted from high-purity alumina, ensuring superior thermal conductivity and excellent electrical insulation. The nickel-palladium-gold plating enhances corrosion resistance, improves solderability, and provides strong wire bonding capabilities. Designed for efficient heat dissipation and stable electrical performance, this cooling chip is ideal for high-power semiconductor devices, RF applications, laser diodes, and aerospace components. Its double-sided plating guarantees reliable performance even in the most demanding environments.

Specifications

Parameter Details
Materials Nickel, Palladium, Gold, Alumina
Color/Appearance Golden Yellow Plate
Thickness 0.25 mm
Number of Layers Double-sided
Size 2.2 × 3 mm (standard size)
Copper Plate Thickness 18 µm
Finish Immersion Nickel-Palladium-Gold
Line Width and Spacing 0.2 / 0.1 mm

Applications

The Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip is essential in various high-performance applications, including:

  1. High-Power Semiconductor Devices

    • Uses: Power modules, transistors, and integrated circuits
    • Benefits: Efficient heat dissipation and reliable electrical insulation ensure optimal performance.
  2. Laser Diodes

    • Uses: High-brightness laser systems and optical communication devices
    • Benefits: Superior thermal management extends the lifespan and enhances the reliability of laser components.
  3. RF Components

    • Uses: Radio frequency circuits, antennas, and communication modules
    • Benefits: Maintains stable electrical performance under high-frequency operations.
  4. Power Electronics

    • Uses: Power converters, inverters, and energy management systems
    • Benefits: Robust corrosion resistance ensures longevity in demanding power environments.
  5. Aerospace Components

    • Uses: Avionics, satellite systems, and defense electronics
    • Benefits: Reliable thermal management and stability in extreme conditions.
  6. Telecommunications

    • Uses: Base stations, signal processing units, and networking equipment
    • Benefits: Ensures consistent performance and durability in high-demand communication systems.

Packaging

Our Double-Sided Nickel-Palladium-Gold-Plated Alumina Semiconductor Cooling Chips are meticulously packaged to preserve their quality during storage and transportation. Each chip is securely packed to prevent damage, ensuring that it reaches our customers in pristine condition.

Frequently Asked Questions (FAQ)

Q1: What is a Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip?
A1: It is a high-performance cooling solution made from alumina, featuring nickel-palladium-gold plating on both sides. This enhances heat dissipation, electrical insulation, and corrosion resistance, making it ideal for high-power semiconductor applications.

Q2: What are the key benefits of using this cooling chip?
A2:

  • Excellent Thermal Conductivity: Efficiently dissipates heat in high-power environments.
  • Superior Electrical Insulation: Ensures stable and reliable electrical performance.
  • High Mechanical Strength: Provides durable support for semiconductor devices.
  • Enhanced Corrosion Resistance: Extends the lifespan of the chip in harsh conditions.
  • Improved Solderability and Wire Bonding: Facilitates secure and efficient connections.

Q3: What are the typical applications for this cooling chip?
A3:

  • High-Power Semiconductor Devices: Power modules, transistors, and integrated circuits.
  • Laser Diodes: High-brightness laser systems and optical communication devices.
  • RF Components: Radio frequency circuits, antennas, and communication modules.
  • Power Electronics: Power converters, inverters, and energy management systems.
  • Aerospace Components: Avionics, satellite systems, and defense electronics.
  • Telecommunications: Base stations, signal processing units, and networking equipment.
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