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PBN Crucibles for Precision Application

Pyrolytic Boron Nitride Crucible can withstand high temperatures in a high vacuum environment. It has excellent thermal conductivity, corrosion resistance, and electrical resistance.

Pyrolytic Boron Nitride (PBN)

Pyrolytic Boron Nitride (PBN) is a kind of boron nitride ceramic prepared by high-temperature pyrolysis reaction by chemical vapor deposition. This process involves the reaction of ammonia and boron halide under elevated temperatures and high vacuum conditions. PBN offers versatility in its deposition, allowing for the creation of sheet material or direct production of final products like tubes, rings, or thin-walled containers. In contrast to conventional hot-pressed boron nitride (BN), PBN eliminates the need for a standard hot-press sintering process and does not require the addition of any sintering agent.

One of the most notable aspects of Pyrolytic Boron Nitride is its exceptional properties, making it a highly sought-after material in various applications. Its characteristics include extreme purity, excellent oxide resistance, robust thermal shock resistance, high insulation resistance, and non-reactivity to most other compounds. Moreover, PBN demonstrates remarkable resilience in withstanding high temperatures. These properties collectively position Pyrolytic Boron Nitride as a valuable material with wide-ranging capabilities, contributing to its prominence in advanced technological and industrial applications.

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Pyrolytic Boron Nitride Structures

Pyrolytic boron nitride (PBN) exhibits unique structures that stem from its distinct preparation process. As a ceramic material, PBN is crafted through high-temperature pyrolysis reaction using chemical vapor deposition. This results in a structure that differs from conventional boron nitride ceramics like hot-pressed boron nitride (BN). Unlike the latter, PBN does not require a conventional hot-press sintering process, showcasing a structural independence that contributes to its versatility.

The structure of Pyrolytic Boron Nitride is notable for its purity and uniformity, as it can be deposited in various forms such as sheets, or directly as final products like tubes, rings, and thin-walled containers. The high-temperature and high-vacuum conditions during the deposition process contribute to the development of these well-defined structures. This structural precision, combined with the absence of sintering agents, underscores PBN's unique position as an advanced material with tailored structures, making it suitable for a range of applications across industries.

Pyrolytic Boron Nitride Specification

Physical Properties
Density	1.95 - 2.22 g/cc
Mechanical Properties
Tensile Strength, Ultimate （23°C）	40.0 MPa
Tensile Strength, Ultimate （23°C）	103 MPa
Modulus of Elasticity	22.0 GPa
Flexural Strength	80.0 MPa
Compressive Strength	234 MPa
Poissons Ratio	0.25
Shear Modulus	8.80 GPa
Electrical Properties
Electrical Resistivity	1.00e+15 ohm-cm
Dielectric Constant	3.4
Dielectric Constant	5.2
Dielectric Strength	200 kV/mm
Thermal Properties
Thermal Conductivity	2.00 W/m-K
Thermal Conductivity	60.0 W/m-K
Maximum Service Temperature, Air	750 °C
Maximum Service Temperature, Inert	2500 °C

Pyrolytic Boron Nitride Applications

Pyrolytic Boron Nitride (PBN) ceramics boast a diverse range of applications, capitalizing on their unique properties such as high purity, chemical inertness, and exceptional thermal conductivity. This advanced material finds itself at the heart of technological and industrial advancements across various sectors:

Semiconductor Manufacturing:

PBN Crucibles for Elemental Purification: Leveraging its high purity and chemical inertness, PBN crucibles play a pivotal role in elemental purification, ensuring semiconductor materials remain free from impurities.
Crystal Growth Processes: PBN contributes to the meticulous process of crystal growth, facilitating the formation of high-quality crystals crucial for manufacturing reliable semiconductor devices.
Next-Generation Compound Semiconductors: Particularly essential in the production of advanced compound semiconductors like Gallium Arsenide (GaAs) and Indium Phosphide (InP), PBN plays a key role in shaping the future of electronic components.

Aerospace and Aviation:

High-Temperature Stability: In aerospace and aviation applications, where extreme temperatures and harsh conditions are prevalent, PBN's stability becomes indispensable. Its ability to withstand high temperatures without compromising structural integrity makes it valuable in manufacturing components for aerospace exploration.

Electronics:

Advanced Electronic Devices: PBN components contribute to the development of high-performance electronic devices. Its excellent thermal management capabilities ensure efficient heat dissipation, enhancing the reliability and longevity of electronic components in demanding applications.

Chemical Industry:

Chemical Inertness in Processes: PBN's chemical inertness finds application in various chemical processes. PBN equipment and components can operate in environments with aggressive chemicals without undergoing degradation, making it a reliable choice in chemical industry applications.

Special Metallurgy:

Specialized Metallurgical Processes: Harnessing PBN's unique properties, industries engage in specialized metallurgical processes where resistance to chemical reactions and high temperatures is advantageous for specific alloying and refining procedures.

Medical Applications:

Chemically Inert Medical Equipment: PBN's chemical inertness is beneficial in the design and manufacturing of medical equipment and devices where maintaining a sterile and non-reactive environment is crucial. Applications include medical implants and laboratory equipment.

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Advanced Ceramic Materials is a leading supplier of pyrolytic boron nitride ceramic products of the highest quality for a wide range of applications. We are happy to provide advice on materials, design, and application. Feel free to contact us with any questions about PBN or other ceramic materials that are not listed on the website.

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FAQs

What Is the Structure and Morphology of PBN?

Pyrolytic boron nitride (PBN) belongs to the hexagonal system and is a typical layered material. The inter-layer and inter-layer atomic spacing is quite different, the inter-layer atom spacing is 3.33, and the intra-layer atom spacing is 1.45. The structure of the PBN consists of alternating B and N atoms in the layer and along the C axis, respectively, and the stacking method is ababab???. It can be observed under a high power microscope that PBN exhibits stacking faults, resulting in an average layer spacing greater than the theoretical layer spacing. Since the PBN grows in the C-axis direction during the deposition process, it exhibits a high degree of layer orientation, and the preferred orientation direction is the C-axis.

How Is PBN Produced?

PBN is produced using a chemical vapor deposition (CVD) process, where boron and nitrogen gases are reacted at high temperatures to produce a solid boron nitride layer on a substrate material. The layer can be deposited on a variety of substrates, including graphite, silicon, and metal.

What Are the Different Types of PBN?

There are two main types of PBN: isotropic PBN (i-PBN) and anisotropic PBN (a-PBN). i-PBN has a uniform structure and properties in all directions, while a-PBN has an oriented structure that results in anisotropic properties. a-PBN is typically used in applications where high thermal conductivity in one direction is needed, such as in heat sinks or thermal management components. Q: What is the thermal stability of PBN?

How Does PBN Compare to Other Ceramics in Terms of Properties?

PBN has several advantages over other ceramics, including high thermal conductivity, low thermal expansion, high temperature stability, and good electrical insulation properties. It is also relatively inert and can withstand exposure to a wide range of chemicals and corrosive environments.

Can Pyrolytic Boron Nitride Withstand High Temperatures, and How Is This Property Utilized in Applications?

Yes, Pyrolytic Boron Nitride can withstand high temperatures. This property is particularly valuable in applications where materials need to maintain structural integrity and performance under extreme heat conditions. Industries such as aerospace, where components may experience elevated temperatures during operation, benefit from PBN's high-temperature stability.

What Role Does PBN Play in Crystal Growth, and Why Is It Essential in The Semiconductor Industry?

PBN is crucial in crystal growth processes within the semiconductor industry. Its stability and purity contribute to the formation of high-quality crystals, a fundamental step in manufacturing reliable semiconductor devices. The use of PBN in crystal growth ensures that the resulting semiconductor materials meet stringent quality standards for electronic applications.

Can PBN Be Customized for Specific Applications, and How Versatile Is It in Terms of Deposition and Usage?

PBN's versatility is evident in its ability to be deposited in various forms, such as sheets or directly into final products like tubes and rings. This flexibility allows for customization based on specific application requirements. Industries ranging from semiconductor manufacturing to medical applications benefit from PBN's adaptability, making it a versatile material in diverse technological and industrial settings.

Properties

Chemical Formula	PBN
Mechanical
Density	2.0-2.2 g/cm3
Hardness	4 Mohs
Modulus of Elasticity	40 GPa
Flexural Strength	85 Mpa
Compressive Strength	200 MPa
Poisson's Ratio	0.11
Fracture Toughness	1.5 MPa·m¹/²
Electrical
Dielectric Strength	56 kV/mm
Dielectric Constant	4.0 (@ 1 MHz)
Volume Resistivity	>10¹³ ohm·cm
Thermal
Coefficient of Thermal Expansion	1.4 x 10^-6 /°C
Thermal Conductivity	60 W/m·K
Specific Heat	0.8 J/g·K
Shock Resistance	-
Maximum Working Temperature	1800 °C