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MC6508 Nickel-Gold Plated Aluminum Nitride Substrate

  • Catalog No. MC6508
  • Material Nickel, Gold, AlN
  • Thickness 1.0 mm

MC6508 Nickel-Gold Plated Aluminum Nitride Substrate

Nickel-Gold Plated Aluminum Nitride Substrate
Nickel-Gold Plated Aluminum Nitride Substrate

Description

The Nickel-Gold Plated Aluminum Nitride Substrate leverages high-purity aluminum nitride to provide outstanding thermal management and electrical insulation. The substrate’s construction includes a double-sided nickel-gold plating that not only enhances solderability but also offers superior protection against corrosion and oxidation. The addition of a 0.07mm copper layer significantly improves electrical conductivity, supporting high-power applications with ease.

Key features of this substrate include:

  • High Thermal Conductivity: Efficiently dissipates heat, ensuring optimal performance in high-power scenarios.
  • Electrical Insulation: Provides reliable electrical isolation, crucial for stable and efficient operation of electronic components.
  • Durability and Stability: Exhibits low thermal expansion and high mechanical strength, ensuring long-term reliability in demanding environments.
  • Enhanced Solderability: Nickel-gold plating facilitates secure and efficient solder connections, minimizing the risk of electrical failures.

Whether utilized in power electronics, semiconductor devices, or high-frequency circuits, this substrate ensures consistent and reliable performance, making it a preferred choice for advanced electronic systems.

Specifications

Parameter Details
Materials Nickel, Gold, Aluminum Nitride (AlN)
Thickness 1.0 mm
Number of Layers Double-sided
Size 40 × 40 mm
Copper Thickness 0.07 mm
Surface Treatment Immersion Nickel-Palladium
Line Width and Spacing 0.25 / 0.2 mm

Applications

The Nickel-Gold Plated Aluminum Nitride Substrate is versatile and essential for a variety of high-performance applications, including:

  1. Power Electronics

    • Uses: LED drivers, power modules, converters
    • Benefits: Facilitates efficient thermal management and high electrical conductivity for reliable power distribution.
  2. Semiconductor Devices

    • Uses: Chip carriers, integrated circuits, high-performance semiconductors
    • Benefits: Enhances electrical performance and provides excellent insulation for stable semiconductor operation.
  3. High-Frequency Circuits

    • Uses: RF modules, high-speed data transmission, communication devices
    • Benefits: Maintains signal integrity and minimizes thermal disturbances in high-frequency environments.
  4. Advanced Electronic Systems

    • Uses: High-performance computing, precision instruments, scientific equipment
    • Benefits: Ensures durability and long-term stability, supporting complex and sensitive electronic functions.
  5. Automotive Electronics

    • Uses: Electric vehicle components, advanced driver assistance systems (ADAS)
    • Benefits: Robust thermal and electrical properties suitable for the demanding automotive environment.
  6. Aerospace and Defense

    • Uses: Avionics, satellite systems, defense electronics
    • Benefits: Reliable performance and durability under extreme conditions, ensuring mission-critical operations.

Packaging

Our Nickel-Gold Plated Aluminum Nitride Substrate is meticulously packaged to maintain its quality and integrity during storage and transportation. Each substrate is individually secured to prevent any physical damage, ensuring it arrives at your facility in pristine condition. This careful handling guarantees that the substrate is ready for immediate integration into your high-performance electronic systems without any compromise in functionality or reliability.

Frequently Asked Questions (FAQ)

Q1: What is the Nickel-Gold Plated Aluminum Nitride Substrate?
A1: The Nickel-Gold Plated Aluminum Nitride Substrate is a high-performance electronic substrate made from aluminum nitride (AlN) with nickel-gold plating on both sides. It features a 0.07mm copper layer that enhances thermal conductivity and electrical performance, making it ideal for power electronics, semiconductor devices, and high-frequency circuits.

Q2: What are the benefits of the nickel-gold plating on this substrate?
A2: The double-sided nickel-gold plating significantly improves solderability, enhances electrical conductivity, and provides excellent corrosion resistance. These features ensure long-term reliability and efficient performance in demanding and high-precision applications.

Q3: What is the thermal conductivity of this substrate?
A3: The aluminum nitride (AlN) base of the substrate offers excellent thermal conductivity, which is essential for efficient heat dissipation in applications that require optimal thermal management, such as high-power electronics and high-frequency circuits.

Q4: What applications are best suited for this substrate?
A4: This substrate is ideal for a range of high-performance applications including LED drivers, power modules, semiconductor devices, high-frequency circuits, automotive electronics, aerospace navigation systems, and other advanced electronic and optical systems that require efficient thermal management and electrical insulation.

Q5: How is the substrate protected during transportation?
A5: Our substrates are carefully handled and securely packaged to prevent any physical damage during storage and transportation. This ensures that each Nickel-Gold Plated Aluminum Nitride Substrate arrives in pristine condition, ready for immediate use in your applications.

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