The Nickel-Gold Plated Aluminum Nitride Substrate leverages high-purity aluminum nitride to provide outstanding thermal management and electrical insulation. The substrate’s construction includes a double-sided nickel-gold plating that not only enhances solderability but also offers superior protection against corrosion and oxidation. The addition of a 0.07mm copper layer significantly improves electrical conductivity, supporting high-power applications with ease.
Key features of this substrate include:
Whether utilized in power electronics, semiconductor devices, or high-frequency circuits, this substrate ensures consistent and reliable performance, making it a preferred choice for advanced electronic systems.
Parameter | Details |
---|---|
Materials | Nickel, Gold, Aluminum Nitride (AlN) |
Thickness | 1.0 mm |
Number of Layers | Double-sided |
Size | 40 × 40 mm |
Copper Thickness | 0.07 mm |
Surface Treatment | Immersion Nickel-Palladium |
Line Width and Spacing | 0.25 / 0.2 mm |
The Nickel-Gold Plated Aluminum Nitride Substrate is versatile and essential for a variety of high-performance applications, including:
Power Electronics
Semiconductor Devices
High-Frequency Circuits
Advanced Electronic Systems
Automotive Electronics
Aerospace and Defense
Our Nickel-Gold Plated Aluminum Nitride Substrate is meticulously packaged to maintain its quality and integrity during storage and transportation. Each substrate is individually secured to prevent any physical damage, ensuring it arrives at your facility in pristine condition. This careful handling guarantees that the substrate is ready for immediate integration into your high-performance electronic systems without any compromise in functionality or reliability.
Q1: What is the Nickel-Gold Plated Aluminum Nitride Substrate?
A1: The Nickel-Gold Plated Aluminum Nitride Substrate is a high-performance electronic substrate made from aluminum nitride (AlN) with nickel-gold plating on both sides. It features a 0.07mm copper layer that enhances thermal conductivity and electrical performance, making it ideal for power electronics, semiconductor devices, and high-frequency circuits.
Q2: What are the benefits of the nickel-gold plating on this substrate?
A2: The double-sided nickel-gold plating significantly improves solderability, enhances electrical conductivity, and provides excellent corrosion resistance. These features ensure long-term reliability and efficient performance in demanding and high-precision applications.
Q3: What is the thermal conductivity of this substrate?
A3: The aluminum nitride (AlN) base of the substrate offers excellent thermal conductivity, which is essential for efficient heat dissipation in applications that require optimal thermal management, such as high-power electronics and high-frequency circuits.
Q4: What applications are best suited for this substrate?
A4: This substrate is ideal for a range of high-performance applications including LED drivers, power modules, semiconductor devices, high-frequency circuits, automotive electronics, aerospace navigation systems, and other advanced electronic and optical systems that require efficient thermal management and electrical insulation.
Q5: How is the substrate protected during transportation?
A5: Our substrates are carefully handled and securely packaged to prevent any physical damage during storage and transportation. This ensures that each Nickel-Gold Plated Aluminum Nitride Substrate arrives in pristine condition, ready for immediate use in your applications.