Aluminum Nitride is most often the material of choice due to its relatively excellent thermal conductivity and non-toxic nature. It features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties.
This makes aluminum nitride predestined for use in power and microelectronics applications. For example, it is used as a circuit carrier (substrate) in semiconductors or as a heat-sink in LED lighting technology or high-power electronics. Aluminum nitride is resistant to molten aluminum, gallium, iron, nickel, molybdenum, silicon and boron. AlN can be metalized, plated and brazed. It is also a good electrical insulator and can be easily metallized if required. For this reason the material is often used as a heat sink or in other applications where it is desirable to remove heat quickly. Aluminum nitride can be formed into large shapes and is also readily available as a thin substrate.
Aluminium Nitride is principally used in the electronics area, particularly when heat removal is an important function. The high thermal conductivity and excellent electrical insulation makes Aluminium Nitride suitable for a range of extreme environments and particularly suited to demanding electrical applications.
The properties of Aluminum Nitride are high thermal conductivity, high electrical insulation capacity and Low thermal expansion.
Specific aluminium nitride applications include:
• IC packages
• Power transistor bases
• Microwave device packages
• Heat sinks
• Electronic substrates
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