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Aluminum Nitride is most often the material of choice due to its relatively excellent thermal conductivity and non-toxic nature. It features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties. This makes aluminum nitride predestined for use in power and microelectronics applications.
Aluminum Nitride is principally used in the electronics area, particularly when heat removal is an important function. The high thermal conductivity and excellent electrical insulation make Aluminium Nitride suitable for a range of extreme environments and particularly suited to demanding electrical applications. Specific aluminum nitride applications include IC packages, power transistor bases, microwave device packages, heat sinks, and electronic substrates.
The properties of Aluminum Nitride are high thermal conductivity, high electrical insulation capacity, and low thermal expansion. Aluminum nitride is resistant to molten aluminum, gallium, iron, nickel, molybdenum, silicon, and boron. AlN can be metalized, plated, and brazed. It is also a good electrical insulator and can be easily metalized if required. For this reason, the material is often used as a heat sink or in other applications where it is desirable to remove heat quickly. Aluminum nitride can be formed into large shapes and is also readily available as a thin substrate.
In the power and microelectronics fields, aluminum nitride is used as a circuit carrier (substrate) in semiconductors or as a heat sink in LED lighting technology or high-power electronics. Its exceptional combination of very high thermal conductivity and excellent electrical insulation properties make it predestined for use in power and microelectronics applications.
Advanced Ceramic Materials (ACM) supplies high-quality aluminum nitride ceramics and related products to meet our customers' R&D and production needs. Please visit https://www.preciseceramic.com/ for more information.
