Description

The Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate leverages the high thermal conductivity of aluminum nitride (AlN) alongside premium silver plating to deliver both superior thermal and electrical performance. Designed for high-density applications, this ceramic substrate offers excellent electrical insulation, ensuring stable operation in compact electronic assemblies. With a thermal conductivity ranging from 170 to 200 W/m·K, it effectively manages heat, maintaining optimal temperatures in power modules and high-frequency devices. The fine-pitch design allows for the dense placement of components, enabling more compact and efficient electronic systems. Additionally, the silver plating enhances solderability, providing strong, high-quality solder joints while offering robust protection against corrosion, thereby extending the substrate's lifespan and reliability.

Key Features:

• High Thermal Conductivity: Efficiently dissipates heat, ensuring optimal operating temperatures in high-performance and high-density applications.
• Excellent Electrical Insulation: Provides reliable electrical isolation, essential for the stable performance of compact electronic components.
• Fine-Pitch Design: Facilitates the compact assembly of electronic components, maximizing space efficiency without compromising performance.
• Enhanced Solderability: Silver plating improves soldering processes, ensuring secure and dependable electrical connections.
• Corrosion Resistance: Silver coating protects against oxidation and environmental degradation, enhancing the substrate's durability.
• High Mechanical Strength: Ensures structural integrity and longevity, suitable for rigorous and demanding electronic environments.
• Temperature Stability: Capable of withstanding high temperatures, and maintaining consistent performance under thermal stress.

Whether integrated into power modules, RF devices, or LED packaging, this ceramic substrate guarantees sustained performance and reliability, making it a preferred solution for advanced, space-constrained electronic assemblies.

Specifications

Applications

The Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate is indispensable for a wide range of high-density and high-performance applications, including:

1. Power Modules

   • Uses: Power converters, inverters, and switching modules
   • Benefits: Ensures efficient thermal management and reliable electrical insulation in compact power distribution systems.

2. RF and Microwave Devices

   • Uses: RF modules, microwave circuits, antennas
   • Benefits: Maintains signal integrity and minimizes thermal interference in high-frequency environments, enhancing device performance.

3. LED Packaging

   • Uses: High-brightness LEDs, LED arrays, and LED drivers
   • Benefits: Facilitates effective heat dissipation and stable electrical connections, ensuring prolonged LED lifespan and consistent light output.

4. Automotive Electronics

   • Uses: Electric vehicle systems, advanced driver-assistance systems (ADAS), engine control units (ECUs)
   • Benefits: Provides robust thermal and electrical properties suitable for the demanding automotive environment, ensuring reliable operation under varying conditions.

5. Aerospace and Defense Electronics

   • Uses: Avionics, satellite systems, defense communication devices
   • Benefits: Offers reliable performance and durability under extreme conditions, ensuring mission-critical operations remain unaffected.

6. High-Frequency Applications

   • Uses: Communication devices, high-speed data transmission systems
   • Benefits: Low dielectric loss and high-temperature stability support efficient and reliable performance in high-frequency applications.

7. Compact Electronic Systems

   • Uses: Wearable electronics, portable devices, compact sensors
   • Benefits: Fine-pitch design enables the integration of multiple components in limited spaces without compromising thermal and electrical performance.

Packaging

Our Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate is meticulously packaged to maintain its quality and integrity during storage and transportation. Each substrate is individually secured using protective materials to prevent any physical damage, ensuring it arrives at your facility in pristine condition. This careful handling guarantees that the substrate is ready for immediate integration into your high-performance electronic systems without any compromise in functionality or reliability.

Frequently Asked Questions (FAQ)

Q1: What are the key features of the Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate?
A1: This substrate offers high thermal conductivity (170-200 W/m·K), excellent electrical insulation, and a fine-pitch design. The silver plating enhances solderability and provides corrosion resistance, ensuring reliable and durable electrical connections in compact electronic assemblies.

Q2: What is the thermal conductivity of this AlN ceramic substrate?
A2: The Fine-Pitch Silver-Plated AlN Ceramic Substrate boasts exceptional thermal conductivity, typically around 170-200 W/m·K, enabling efficient heat dissipation in high-performance and high-density applications.

Q3: What applications are suitable for this fine-pitch AlN substrate?
A3: It is ideal for power modules, RF and microwave devices, LED packaging, automotive electronics, aerospace and defense electronics, high-frequency applications, and other compact, high-performance electronic systems that require efficient thermal management and reliable electrical insulation.

Q4: How is the Fine-Pitch Silver-Plated AlN Ceramic Substrate protected during transportation?
A4: Our substrates are carefully handled and securely packaged to prevent any physical damage during storage and transportation. This ensures that each Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate arrives in pristine condition, ready for immediate use in your applications.

Q5: What advantages does silver plating provide on the AlN ceramic substrate?
A5: Silver plating enhances solderability, ensuring secure and reliable electrical connections. It also offers excellent corrosion resistance, protecting the substrate from environmental degradation and extending its operational lifespan.