Description

The Gold-Plated Aluminum Nitride (AlN) Ceramic Substrate leverages the high thermal conductivity of aluminum nitride (AlN) combined with premium gold plating to enhance both thermal and electrical performance. This ceramic substrate is engineered to provide excellent electrical insulation and withstand high temperatures, ensuring reliable operation in demanding environments. With a thermal conductivity ranging from 170 to 200 W/m·K, it effectively manages heat, maintaining optimal temperatures in power electronics and high-frequency devices. The gold plating not only improves solderability but also offers superior protection against corrosion, ensuring stable and long-lasting electrical connections. This makes the substrate ideal for use in power modules, RF applications, and LED packages where efficient heat dissipation and electrical insulation are critical.

Key Features:

• Superior Thermal Conductivity: Efficiently dissipates heat, maintaining optimal operating temperatures in high-power and high-frequency applications.
• Excellent Electrical Insulation: Provides reliable electrical isolation, essential for the stable performance of electronic components.
• High Mechanical Strength: Ensures durability and structural integrity, suitable for rigorous and demanding applications.
• Enhanced Solderability: Gold plating facilitates easy and secure solder connections, reducing the risk of electrical failures.
• Corrosion Resistance: Gold coating protects against oxidation and environmental degradation, extending the substrate's lifespan.
• Temperature Stability: Capable of withstanding high temperatures, ensuring consistent performance under thermal stress.
• Reliable Electrical Connections: Ensures strong and stable connections, critical for the dependable operation of electronic systems.

Whether integrated into power modules, RF devices, or LED packaging, this ceramic substrate guarantees sustained performance and reliability, making it a preferred solution for advanced electronic assemblies.

Specifications

Applications

The Gold-Plated Aluminum Nitride (AlN) Ceramic Substrate is versatile and essential for a wide range of high-performance applications, including:

1. Power Electronics

   • Uses: Power modules, inverters, converters
   • Benefits: Ensures efficient thermal management and reliable electrical insulation for robust power distribution and control.

2. RF and Microwave Devices

   • Uses: RF modules, microwave circuits, antennas
   • Benefits: Maintains signal integrity and minimizes thermal interference in high-frequency environments, enhancing performance and reliability.

3. LED Packaging

   • Uses: High-brightness LEDs, LED arrays
   • Benefits: Facilitates effective heat dissipation and stable electrical connections, ensuring prolonged LED lifespan and consistent light output.

4. Automotive Electronics

   • Uses: Electric vehicle systems, advanced driver-assistance systems (ADAS), engine control units (ECUs)
   • Benefits: Provides robust thermal and electrical properties suitable for the demanding automotive environment, ensuring reliable operation under varying conditions.

5. Aerospace and Defense Electronics

   • Uses: Avionics, satellite systems, defense communication devices
   • Benefits: Offers reliable performance and durability under extreme conditions, ensuring mission-critical operations remain unaffected.

6. High-Frequency Applications

   • Uses: Communication devices, high-speed data transmission systems
   • Benefits: Low dielectric loss and high-temperature stability support efficient and reliable performance in high-frequency applications.

7. LED Modules and Laser Diodes

   • Uses: Laser modules, optoelectronic assemblies
   • Benefits: Enhances thermal management and ensures stable electrical connections, contributing to the longevity and performance of optoelectronic components.

Packaging

Our Gold-Plated Aluminum Nitride (AlN) Ceramic Substrate is meticulously packaged to maintain its quality and integrity during storage and transportation. Each substrate is individually secured using protective materials to prevent any physical damage, ensuring it arrives at your facility in pristine condition. This careful handling guarantees that the substrate is ready for immediate integration into your high-performance electronic systems without any compromise in functionality or reliability.

Frequently Asked Questions (FAQ)

Q1: What are the key features of the Gold-Plated Aluminum Nitride (AlN) Ceramic Substrate?
A1: This substrate offers excellent thermal conductivity (170-200 W/m·K), superior electrical insulation, high mechanical strength, and robust gold plating. These features ensure efficient heat dissipation, reliable electrical connections, and long-term durability, making it ideal for demanding electronic applications.

Q2: What is the typical thermal conductivity of this AlN ceramic substrate?
A2: The Aluminum Nitride (AlN) Ceramic Substrate has a thermal conductivity of approximately 170-200 W/m·K, enabling effective heat dissipation in high-power and high-frequency applications.

Q3: What are the main applications of this gold-plated AlN substrate?
A3: It is ideal for use in power electronics, RF and microwave devices, LED packaging, automotive electronics, aerospace and defense electronics, and other high-performance applications where efficient thermal management and reliable electrical insulation are required.

Q4: How is the Gold-Plated AlN Ceramic Substrate protected during transportation?
A4: Our substrates are carefully handled and securely packaged to prevent any physical damage during storage and transportation. This ensures that each Gold-Plated Aluminum Nitride (AlN) Ceramic Substrate arrives in pristine condition, ready for immediate use in your applications.

Q5: What advantages does gold plating provide on the AlN ceramic substrate?
A5: Gold plating enhances solderability, ensuring secure and reliable electrical connections. It also offers excellent corrosion resistance, protecting the substrate from environmental degradation and extending its operational lifespan.