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BN4001 Hexagonal Boron Nitride Film (h-BN Film)

Catalog No. BN4001
Type Substrate: copper foil.
Size 5*10, 10*10, 10*20 (mm)
Method Chemical Vapor Deposition (CVD)

HBN Film Description

ACM provides Hexagonal Boron Nitride Film (h-BN Film) on copper foil. Copper-based HBN films are deposited by chemical vapor deposition (CVD) on high-purity copper foils with single-layer and multi-layer h-BN films. Single-layer h-BN (Boron Nitride) monolayer thick film is grown onto 50 um thick copper foils. h-BN is an insulator with a direct bandgap of 6 eV with strong ionic bonding between B-N atoms.

HBN Film Specification

Type Substrate: copper foil.
Size (mm) 5*10, 10*10, 10*20
Crystal Structure Hexagonal Phase
Method Chemical Vapor Deposition (CVD)

HBN Film Applications

* Plasma arc welding applications

* Semiconductor crystal growth equipment and processing

HBN Film Packaging

Our Hexagonal Boron Nitride Film (h-BN Film) is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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