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A built-in electrode is embedded, using the electrostatic force generated between the structure and the silicon wafer placed on the surface of the ESC. In the semiconductor manufacturing process, this type of product can be used for silicon wafer installation, flatness correction, and silicon wafer cooling.
- Designed for φ200/300mm Equipment
- High-purity Al2O3/AlN/Sapphire material
- High plasma durability
- Good chucking/de-chucking response
- Withstand the extreme natural condition of some samples in both high and low temperature
| Material Item | Sapphire |
| Color | Transparent |
| Content (%) | 99.99 |
| Density (g/cm3) | 3.97 |
| Vickers Hardness HV9.807N (Gpa) | 22.5 |
| Young's Modulus (Gpa) | 470 |
| Compressive Strength (Mpa) | 2,940 |
| Thermal Conductivity (20℃) (W/(m·K) | 41 |
Electrostatic Chuck is used for silicon wafer installation, flatness correction, and silicon wafer cooling.
Our Electrostatic Chuck is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
